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Good Insulation High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers

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Good Insulation High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers

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Brand Name : ZIITEK

Model Number : TIF100-50-50E

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : Negotiation

Supply Ability : 10000/day

Delivery Time : 3-5work days

Packaging Details : 1000pcs/bag

Products name : Good Insulation High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers

Thickness : Available In Varies Thicknes

Keywords : Thermally Gap Pad Filler

Hardness : 35 Shore 00

Construction & Compostion : Ceramic filled silicone elastomer

Specific Gravity : 3.3 g/cc

Flame Rating : 94 -V0

Thermal conductivity : 5.0 W/mK

Application : AI Processors AI Servers

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Good Insulation High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers

TIF®100-50-50E Series is a well-balanced, general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness. This balanced design provides both good surface conformity and excellent ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.


Features:


> Good thermal conductive:5.0W/mK
> Available in varies thickness

> Good flexibility and fillability
> Self-adhesive without the need for additional surface adhesives
> ​Good insulation performance


Applications:

> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

> AI Processors AI Servers

Typical Properties of TIF®100-50-50E Series
Property Value Test method
Color Pink Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.3 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.5) (0.75~5.0)
Hardness 65 Shore 00 35 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 9.0MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 5.0 W/m-K ASTM D5470
5.0 W/m-K ISO22007
Good Insulation High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers
Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Good Insulation High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.


Product Tags:

silicone thermal gap filler

      

AI processor thermal pad

      

high performance gap filler

      
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Good Insulation High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers Images

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