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Thermal Conductive Phase Change Material 9.6W/mK With The Good Flow Ability Over Phase Change Temperature For Chip Sets

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Thermal Conductive Phase Change Material 9.6W/mK With The Good Flow Ability Over Phase Change Temperature For Chip Sets

Name: Thermal Conductive Phase Change Material 96WmK With The Good Flow Ability Over Phase Change Temperature For Chip Sets
Brand: Ziitek
Price: 1 USD

Buy cheap Thermal Conductive Phase Change Material 9.6W/mK With The Good Flow Ability Over Phase Change Temperature For Chip Sets product

Product Name : Thermal Conductive Phase Change Material 9.6W/mK With The Good Flow Ability Over Phase Change Temperature For Chip Sets

Color : Gray

Thermal Conductivity : 9.6W/mK

Packaging Details : 1000pcs/bay

Application : Server CPU &Chip Sets

Brand Name : Ziitek

Certification : RoHs

Model Number : TIC808T

Supply Ability : 100000pcs/day

Price : negotiation

Payment Terms : T/T

Phase Change Softening Temperature(℃） : 50℃~60℃

Delivery Time : 7-15days

Recommend Operating Temperature : -40℃～125℃

Place of Origin : China

Density : 2.8g/cm³

Keywords : Phase Changing Materials

MOQ : 1000PCS

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Thermal Conductive Phase Change Material 9.6W/mK With The Good Flow Ability Over Phase Change Temperature For Chip Sets

The TIC^®800T Series is an ultra-high thermal conductivity phase change material with a unique grain orientation structure. This structure achieves directional optimization of the heat flow path through micro ordered arrangement, significantly doubling the macroscopic thermal conductivity efficiency. When the temperature exceeds the phase transition point of 50℃, the material can soften and infiltrate the interface, filling micro irregular gaps, and ultimately forming a heat conduction channel with extremely low thermal resistance at the contact surface, improving the eficiency of the heat dissipation system.

Features

> Excellent thermal conductivity
> Good process compatibility
> Soft surface and self adhesive
> Low steady-state thermal resistance

Applications

> Power conversion equipment
> Payload processor
> Server CPU
> Game graphics card GPU chip heat dissipation

Typical Properties of TIC^®800T Series
Product Name	TIC^®808T	TIC^®810T	Testing standards
Color	Gray		Visual
Thickness(inch/mm)	0.008"	0.010"	ASTM D374
Thickness(inch/mm)	(0.20mm)	(0.25mm)	ASTM D374
Density(g/cm³)	2.8		ASTM D792
Recommended Operating Temperature (℃)	-40～125		-
Phase Change Softening Temperature(℃)	50~60		-
Thermal conductivity	9.6 W/mK		ASTM D5470
Thermal lmpedance (℃-in²/W)@10 psi	0.018	0.019	ASTM D5470
Thermal lmpedance (℃-in²/W)@50 psi	0.013	0.014	ASTM D5470

Product Specifications
Standard Thickness:0.008" (0.20 mm), 0.010" (0.25 mm)
Standard Size: 10" x 16" (254 mm x 406 mm)

TIC^®series can be molded into different shapes to provide. If you need different thicknesses or would like to learn more about thermal conductive materials, please contact our company.

Thermal Conductive Phase Change Material 9.6W/mK With The Good Flow Ability Over Phase Change Temperature For Chip Sets

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

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