Sign In | Join Free | My components-electronic.com
China Dongguan Ziitek Electronical Material and Technology Co., Ltd logo
Dongguan Ziitek Electronical Material and Technology Co., Ltd
Dongguan Ziitek Electronical Material and Technology Co., Ltd. -- Professional TIM Manufacturer
Verified Supplier

11 Years
Home > Thermal Conductive Pad >

High Thermal Conductivity 16W/mK Thermal Conductive Pad Silicone Material For GPU CPU Heatsink AI Servers Cooling Applications

Product Categories
Dongguan Ziitek Electronical Material and Technology Co., Ltd
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now

High Thermal Conductivity 16W/mK Thermal Conductive Pad Silicone Material For GPU CPU Heatsink AI Servers Cooling Applications

  • 1
  • 2

MOQ : 1000pcs

Delivery Time : 3-5 days

Dielectric Constant @1MHz : 7.0

Payment Terms : T/T

Keywords : Thermal Pad

Model Number : TIF800TS

Application : GPU CPU Heatsink AI Servers Cooling Applications

Brand Name : ZIITEK

Products name : High Thermal Conductivity 16W/mK Thermal Conductive Pad Silicone Material For GPU CPU Heatsink AI Servers Cooling Applications

Packaging Details : 1000pcs/bag

Price : Negotiation

Fire rating : 94-V0

Supply Ability : 100000pcs/day

Thermal conductivity : 16.0 W/m-K

Certification : UL and RoHs

Thickness : 0.75~5.0mm

Place of Origin : China

Hardness : 45 Shore 00

Contact Now

High Thermal Conductivity 16W/mK Thermal Conductive Pad Silicone Material For GPU CPU Heatsink AI Servers Cooling Applications


Products description


The TIF®800TS Series is a high-end compressible thermal pad that meets top-level cooling requirements while also ensuring excellent assembly workability. Through an innovative material formulation, it successfully achieves an ideal combination of ultra-high thermal conductivity and moderate hardness. This unique performance balance allows it to efficiently handle the cooling challenges posed by extremely high heat fluxes, while also possessing good mechanical _strength and compressibility, making it easy, to manufacture and install. It provides a thermal interface material solution with both outstanding heat dissipation performance and high reliability for high-power-density electronic devices.


Features:

> Excellent thermal conductivity: 16.0W/mK
> Good softness and filling properties
> Self-adhesive without the need for additional surface adhesive
> Good insulation performance


Applications:


> LED Ceilinglamp
> Monitoring the Power Box
> AD-DC Power Adapters
> AI Servers
> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations


Typical Properties of TIF®800TS Series
Property Value Test method
Color Gray Visual
Construction Ceramic filled silicone elastomer ******
Density(g/cm³) 3.3 ASTM D792
Thickness Range(inch/mm) 0.030 0.040~0.200 ASTM D374
0.75 (1.00~5.00)
Hardness (Shore 00) 45 45 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 16.0W/m-K ISO22007


Products specification


Standard Thickness: 0.030" (0.75 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X 16" (406 mm ×406 mm)


The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

High Thermal Conductivity 16W/mK Thermal Conductive Pad Silicone Material For GPU CPU Heatsink AI Servers Cooling Applications

Company profile

Dongguan Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

FAQ

Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.


Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.


Buy cheap High Thermal Conductivity 16W/mK Thermal Conductive Pad Silicone Material For GPU CPU Heatsink AI Servers Cooling Applications product

High Thermal Conductivity 16W/mK Thermal Conductive Pad Silicone Material For GPU CPU Heatsink AI Servers Cooling Applications Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: Dongguan Ziitek Electronical Material and Technology Co., Ltd
*Subject:
*Message:
Characters Remaining: (0/3000)
 
You May Like