5.0W/MK Thermal Conductive Pad Designed For Easy Application With Naturally Tacky Surface And No Additional Adhesive Coating Needed
Product Overview
The TIF®100 5027-11 Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.
Key Features
- High thermal conductivity
- Super soft and highly compliant
- Self-adhesive without the need for additional surface adhesives
- Good insulation performance
Applications
- Power tools
- Network communication products
- Electric vehicle batteries
- Computer CPU/GPU Cooling
- New energy vehicle power systems
Technical Specifications of TIF®100 5027-11 Series
| Property |
Value |
Test Method |
| Color |
Dark gray |
Visual |
| Construction |
Ceramic filled silicone elastomer |
- |
| Density (g/cm³) |
3.4 |
ASTM D792 |
| Thickness Range (inch/mm) |
0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.00 |
ASTM D374 |
| Hardness (Shore 00) |
65 | 27 |
ASTM 2240 |
| Recommended Operating Temperature (℃) |
-40 to 200 |
- |
| Breakdown Strength (V/mm) |
≥5500 |
ASTM D149 |
| Dielectric Constant @1MHz |
7.0 |
ASTM D150 |
| Volume Resistivity (Ohm-cm) |
＞1.0×10¹² |
ASTM D257 |
| Flame rating |
V-0 |
UL 94 (E331100) |
| Thermal conductivity (W/m-K) |
5.0 |
ASTM D5470
ISO22007 |
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm×406 mm)
Component Codes
Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Company Profile
Dongguan Ziitek Electronic Material and Technology Co., Ltd. was established in 2006. We are a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. Our product portfolio includes:
- Heat-conducting joint filler
- Low melting point thermal interface materials
- Heat-conducting insulator
- Heat-conducting adhesive tape
- Heat-conducting interface pad and heat-conducting grease
- Heat-conducting plastic, silicone rubber, silicone rubber foam
We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
Certifications
ISO9001:2015
ISO14001:2004
IATF16949:2016
IECQ QC 080000:2017
UL Certified
Independent R&D Team
Our dedicated research and development team continuously innovates to meet evolving market demands.
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A:
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